OSI Systems, Inc

  • Manufacturing Engineer

    Location US-CA-Camarillo
    Posted Date 2 months ago(11/26/2018 4:58 PM)
    Company
    Advanced Photonix
    Requisition #
    14755
  • Overview

    OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world. With more than 30 years of combined experience in the field of optoelectronics our OSI Optoelectronics (OSIO) division is a diversified manufacturer of standard and custom photodiodes and optical sensors for used in aerospace, defense, commercial and medical applications.

     

    We are one of the largest global manufacturers of optoelectronic devices, delivering engineering design support and manufacturing capabilities that include products for use in the defense, aerospace, medical, and industrial markets, among others. We utilize our world-class manufacturing facilities in the U.S., India and Malaysia to continue to put forth excellent engineering solutions aligned with efficient manufacturing to meet high-volume production requirements.

     

    Advanced Photonix, a division of OSI Optoelectronics, is seeking a Manufacturing Engineer for the development of processes for semiconductor product manufacturing.  This includes assembly, test and sustaining of photodiode assembly including die singulation, die attach, wirebond, inspections, package sealing. Additional responsibilities include the identification and tracking of Key Performance Indicators for the manufacturing processes.

    Responsibilities

    • Analyze existing processes and develop ways to reduce variability/ increase capacity in process yield, and cycle time.  Perform time studies of processes. Perform failure analysis and root cause determination of fallout.
    • Responsible for establishing control limits in SPC for all relevant owned tools. Work in a cross-functional team environment consisting of engineers and operators, partnering closely with multiple groups within the department.
    • Responsible for creation of written operational procedures and mentoring/training operators.
    • Identify and implement new assembly processes and tools to enable next generation product needs.
    • Design of packages for new photodiode assemblies.
    • Identification of suppliers capable of providing key components, processes, tooling, and manufacturing equipment.
    • Uphold the company’s core values of Integrity, Innovation, Accountability, and Teamwork
    • Demonstrate behavior consistent with the company’s Code of Ethics and Conduct
    • It is the responsibility of every employee to report to their manager or a member of senior management any quality problems or defects in order for corrective action to be implemented and to avoid recurrence of the problem
    • Duties may be modified or assigned at any time to meet the needs of the business.

    Qualifications

    • Bachelors degree in Engineering.
    • 5 years of manufacturing experience in semi-conductor industry
    • Experience with one or more of the following semiconductor product manufacturing processes: die attach via solder or epoxy bonding on automated tool platform, material selection, wire bonder operation/ programing and recipe optimization on automated tool platform, plasma cleaning, epoxy encapsulation hermetic sealing via resistance/laser welding, and SPC.
    • Ability to work in a fast-paced project oriented team environment
    • Familiarity with most of the following is preferred: automated semiconductor manufacturing equipments such as K+S, Datacon, ASM, KLA, Hess Mechatronics and Westbond.
    • Familiarity with Lean Manufacturing and 6-Sigma a plus.
    • Knowledge of MIL-STD 19500 and other relevant industry standards for automated die attach, wire bonding,encapsulation,hermatic packaging etc. of  product qualification is preferred
    • Strong communication skills.
    • Flexible and highly motivated
    • This position will travel to other manufacturing sites if required.

     

    Equal Opportunity Employer

     

    EEO is the Law

     

    Poster Link: http://www1.eeoc.gov/employers/upload/eeoc_self_print_poster.pdf

     

     

    OSI Systems, Inc. has three operating divisions: (a) Security, providing security and inspection systems, turnkey security screening solutions and related services; (b) Healthcare, providing patient monitoring, diagnostic cardiology and anesthesia systems; and (c) Optoelectronics and Manufacturing, providing specialized electronic components and electronic manufacturing services for original equipment manufacturers with applications in the defense, aerospace, medical and industrial markets, among others.

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